Power Module 3.1

Back side:

Improvements over Power Module 3

• Changed package for L1 inductance coil from 1206 to 1210, so one can fit larger coils with a higher maximum current rating on it
• For easier soldering, added thermal reliefs on the filled area for GND on the back side
• For easier soldering, added larger pads for L1/U*/R*/C* components

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• Source: PCB Layout file (for KiCad)
• Used in prototype:
• Prototype 6
• Prototype 7
• Circuit: Circuit 9.1 (power)
• Date: 2021-09-14